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年度重大設備建置:2017年

多功能三維X光顯微影像系統(Multifunctional 3D XCT)

廠牌型號:BRUKER SKYSCAN 2211

Installation Date:2017.12.31.

Multifunctional 3D XCT
  • 功能簡介:
    • 新型微聚焦X光斷層掃描系統,穿透成像,可對材料/元件/生物組織等進行非破壞性的內部三維結構檢測。搭載臨場樣品載台可協助材料合成反應或動態臨場檢測。
  • Instrumental Specification:
    • Source:20-190 kV, 4/10/25 W (Diamond Tungsten), submicron spot size, 5-position filter changer
    • Flat Panel:3 Mp active pixels CMOS flat panel (1920x1536 pixels)
    • CCD:11 Mp cooled CCD (4032x2670 pixels)
    • Stage:Direct drive air bearing with integrated micro-positioning stage using piezo-drives
    • Detail detectability:100nm
    • Scanning volume:Maximum diameter 204 mm, length 200 mm, weight 25 kg
  • Image Resolution & Dealing:
    • 1920x1920x1160 pixels (FP central)
    • 3776x3776x1160 pixels (FP two offset )
    • 4032x4032x2272 pixels (CCD central)
    • 8000x8000x2272 pixels (CCD two offset )
  • Appendix:
    • Heating & cooling stage、auto sample loader、Compressive & tensile stage、Helical scan…

應用說明
Composite, Biomedical and Porous
Composite, Biomedical and Porous
In-Situ, High throughput and High Accuracy
In-Situ, High throughput and High Accuracy